| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board with a mat pattern which has low reliability.SOLUTION: Resin insulating layers 21F and 21S are laminated on a core substrate 100. Conductor layers 22F and 22S are formed on the resin insulating layers 21F and 21S. Conductor layers 22F and 22S of a printed wiring board 1 have mat patterns. The mat patterns are continuously formed in both an x direction and a y direction. An x-y plane is a plane parallel to a first plane F of an insulating substrate 10. The mat patterns are formed of a plurality of division patterns, and a range of an area of the division patterns is 0.4 mmto 2.5 mm.SELECTED DRAWING: Figure 2 |
