发明名称 |
SUBSTRATE WITH COOLER FOR POWER MODULE AND METHOD FOR PRODUCING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate with a cooler for power modules, which is prevented from the occurrence of deformation during brazing of a metal layer that is formed from copper or a copper alloy to a cooler that is formed from aluminum, and which has low thermal resistance and high bonding reliability.SOLUTION: A circuit layer that is formed from copper or a copper alloy is bonded to one surface of a ceramic substrate, while a metal layer that is formed from copper or a copper alloy is bonded to the other surface of the ceramic substrate. A second metal layer that is formed from aluminum or an aluminum alloy is bonded to the metal layer by solid-phase diffusion, and a cooler that is formed from an aluminum alloy is joined to the second metal layer by brazing with use of an Mg-containing Al-based brazing filler material.SELECTED DRAWING: Figure 2C |
申请公布号 |
JP2016082234(A) |
申请公布日期 |
2016.05.16 |
申请号 |
JP20150200784 |
申请日期 |
2015.10.09 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
OI SOTARO;OHIRAKI TOMOYA;KITAHARA JOJI |
分类号 |
H01L23/40;H01L23/473;H01L25/07;H01L25/18;H05K7/20 |
主分类号 |
H01L23/40 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|