LC MODULE LAYOUT ARRANGEMENT FOR CONTACT OPENING ETCH WINDOWS

摘要

PROBLEM TO BE SOLVED: To provide an LC module, in a 3D semiconductor memory, for avoiding large step height caused by an un-continuous part and not reducing an overlay margin of contact patterning.SOLUTION: An LC module layout arrangement creates pairs 130 of an insulating layer 120 and a conducting layer 125 so that adjacent pairs differs in height by height no more than thickness of two insulating/conducting layer pairs.SELECTED DRAWING: Figure 9