| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit module which shields mounting components with a simple structure and enables thickness reduction.SOLUTION: A circuit module according to an embodiment of the invention includes: a first wiring board; a second wiring board; and a shield part. The first wiring board has: a first major surface; a second major surface; and an opening part which is formed from the first major surface to the second major surface. The second wiring board has: a mounting surface mounted on the first wiring board 10; and mounting components mounted on the mounting surface and housed in the opening part. The shield part is provided around the opening part on the first wiring board.SELECTED DRAWING: Figure 1 |
