| 摘要 |
PROBLEM TO BE SOLVED: To inhibit deterioration of the uniformity of the processing speed in a plane of a processing object, which results from pressure concentration of a buff pad contacting with the processing object, and uniformly condition a contact surface of the pad with the processing object.SOLUTION: A buff processing module includes: a buff head 500 which is configured so that a buff pad 502 is attached thereto; a buff arm 600 for holding the buff head 500; and a chamfering structure 900 for chamfering a periphery part 502b of a contact surface 502a of the buff pad 502 which contacts with a wafer W. The chamfering structure 900 includes a conditioning part 800 having a dresser 820 for conditioning the buff pad 502 and a dress table 810 for holding the dresser 820. The buff processing module chamfers the periphery part 502b of the contact surface 502a while conditioning the contact surface 502a of the buff pad 502 with the conditioning part 800.SELECTED DRAWING: Figure 7 |
