| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of preventing the secular warpage of a plating film upon electrolytic copper plating.SOLUTION: Provided is a method for forming a plated film where, in a copper plating solution containing a soluble copper salt of 10 to 70 g/L expressed in terms of bivalent copper ions or the salt thereof by 10 to 300 g/L, when, into a sulfur-containing compound such as sulfides and mercaptos having a concentration of 50 to 10,000 mg/L, (1) a copolymer between a specified nitrogen-containing compound and a salt forming agent such as benzimidazole and imidazoline, (2) a copolymer obtained by polymerizing bipyridyl with alkylene oxide having a salt forming group at the addition mole number of prescribed one or more, and (3) and a leveler selected from polyvinylpyrolidone is made coexistent, compressed stress works on the electrodeposited film obtained from the copper bath, and, since it resists against the tensile stress worked on the film together with time passage, a film almost free from warpage with the lapse of time can be formed.SELECTED DRAWING: None |
