| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which allows for thinning, while reducing the cost.SOLUTION: A multilayer wiring board 1 includes a main wiring board 20 and a wiring structure 10 formed therein. In the main wiring board 20, a plurality of main via conductors 210, 211, 212, 213, increasing the diameter in the same direction, are formed. The wiring structure 10 is provided in an isolating layer 202 located on the outermost side of the main wiring board 20. In the wiring structure 10, a plurality of sub-via conductors 105 are formed. The diameter increasing direction of the main via conductors 210, 211, 212, 213 is different from the diameter increasing direction of the sub-via conductors 105.SELECTED DRAWING: Figure 1 |
