| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing device that can suppress adhesion of nonvolatile materials and has a simple configuration and excellent maintenance performance.SOLUTION: A plasma processing device has a container having a reaction chamber that can be reduced in pressure, a lower electrode for supporting a processing target object in the reaction chamber, a dielectric member which blocks the opening of the container and confronts the processing target object, and a coil that is disposed at the outside of the dielectric member with respect to the reaction chamber and generates plasma in the reaction chamber. An electrode pattern and an insulation film covering the electrode pattern are formed on a surface at the reaction chamber side of the dielectric member.SELECTED DRAWING: Figure 1 |
