| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing tool capable of obtaining a sapphire substrate of low surface roughness, where occurrence of a processing damage layer and a microcrack is prevented effectively, with short processing time and high grinding ratio.SOLUTION: A polishing tool 1 for sapphire is obtained by binding abrasive grains, i.e., inorganic oxide powder capable of solid solution with AlO, by means of a binding agent. The average grain size, calculated by true sphere conversion from the BET specific surface of the inorganic oxide powder is preferably 0.001-20 μm. The inorganic oxide powder is, also preferably, the powder of at least one kind of metal oxide selected from CrO, MgO, FeO and FeO.SELECTED DRAWING: Figure 1 |
