发明名称 HANDY-TYPE WARPAGE MEASURING DEVICE
摘要 PROBLEM TO BE SOLVED: To accurately measure a warpage of a concave bend or a convex bend of a long structure W, while effectively using a space of the plant.SOLUTION: A handy-type warpage measuring device includes: a pair of first contacts 19 provided separated from each other on a bottom face 3f of a device main body 3; a spindle 23 configured to be movably provided in a height direction at a center position between the pair of the first contacts 19 in the device main body 3 and have a second contact 25 on the top end side and protrude and retract relative to a virtual reference line VL in which the second contact 25 connects the most projected region 19a in each first contact 19; a sensor 33 for detecting a retraction amount or a projection amount of the second contact 25 relative to the virtual reference line VL in a state that the pair of the first contacts 19 and the second contact 25 are caused to contact a structure W; and a controller 35 for calculating warpage of a bend of the structure W based on the detected retraction amount and projection amount of the second contact 25 and a length of the inputted structure W.SELECTED DRAWING: Figure 1
申请公布号 JP2016080463(A) 申请公布日期 2016.05.16
申请号 JP20140210599 申请日期 2014.10.15
申请人 AMADA HOLDINGS CO LTD;MARUI TECHNO CO LTD 发明人 KOMATA HITOSHI;KIN HIDETOSHI;KURASAWA YASUYUKI
分类号 G01B5/213;B23K31/00 主分类号 G01B5/213
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