UTILAYER COMPOSITE ELECTRONIC STRUCTURE AND METHOD OF TERMINATING A SIDE OF THE SAME

摘要

The present invention relates to a multilayer composite electronic structure and a method of terminating one side thereof. A method of attaching a chip to a substrate with an outer layer comprising via pillars embedded in a dielectric such as solder mask, with ends of the via pillars flush with the dielectric comprises the steps of: (o) optionally removing organic varnish; (p) positioning a chip having legs terminated with solder bumps in contact with exposed ends of the via pillars; and (q) applying heat to melt the solder bumps and to wet the ends of vias with solder.