APPARATUS FOR GUIDING AND CUTTER HAVING THE SAME

摘要

Provided is a guide device comprising: a device frame; and a guide unit provided in the device frame, guiding a side surface of a material, and guiding to correct an alignment state of the side surface of the material when the material is cut in a width direction. The guide unit includes a guide member configured to change a contact guide point with respect to the side surface of the material. The guide unit includes the guide member having a cylindrical structure in which radiuses are different by portions; and a rotary drive unit provided in the device frame to rotate the guide member. In the present invention, since the guide unit guiding to correct an alignment state of the side surface of the material when the material is cut in a width direction is provided, even when the side surface of the material is not uniform but varied in a longitudinal direction, the side surface of the material is guided to be uniformly aligned, and thus, a cut surface of the material is parallel to another cut surface beforehand and thereafter, whereby quality of a product can be increased and a real yield can be increased in terms of productivity.