| 摘要 |
The present invention relates to an apparatus and a method for treating a substrate. The method for treating the substrate with a solution includes the following steps: a treating solution supplying step for supplying a treating solution onto the substrate by means of a treating solution nozzle; and a rinsing solution supplying step for supplying a rinsing solution onto the substrate by means of a rinsing solution nozzle. In the treating solution supplying step, the treating solution nozzle supplies positively charged ionic water along with the treating solution, whereas negatively charged ionic water isolated from the positively charged ionic water is supplied onto the substrate in the rinsing solution supplying step, thereby increasing the etching and washing rates with regard to the substrate. |
