APPARATUS AND METHOD FOR CUTTING SEMI/NON-CONDUCTOR USING WEDM

摘要

A wire electrical discharge machining (WEDM) method is disclosed. The WEDM method comprises the following steps of: (a) providing one of a non-conductive object and a weakly conductive object having a cutting target surface; (b) providing one of a wire and a cutting tool having a cutting blade edge to cut the one object along the cutting target surface; (c) providing a conductive medium to adhere to the cutting target surface via the cutting blade edge; and (d) applying a current between the one of the wire and the cutting tool and the cutting target surface adhered to the conductive medium to melt the cutting target surface.