METHOD OF FORMING BUMP ELECTRODE BY ELECTROPLATING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of forming a good bump electrode by smoothly preventing the occurrence of voids when forming a bump electrode in a via on a substrate by tin or tin alloy electroplating.SOLUTION: A method of forming a bump electrode comprises filling a via having a specific structure (specifying an aspect ratio and the like) formed on a substrate (a board in particular) by an electroplating method using a tin or tin alloy plating bath in combination with (C) a specific organic compound for filling and (D) a nonionic surfactant and is a method of producing a good bump electrode which achieves via filling smoothly without the occurrence of voids by effectively suppressing the deposition onto an upper part of the via and allowing the metal deposition to proceed preferentially from a bottom part of the via by virtue of the coexistence of the components (C) and (D).SELECTED DRAWING: None