发明名称 THERMOELECTRIC MODULE
摘要 A thermoelectric module according to the present invention includes a first support substrate including a principal surface that includes a first region and a second region that is adjacent to the first region; a second support substrate including a principal surface that faces the first region; a plurality of thermoelectric elements arranged between the first region and the principal surface of the second support substrate; and a temperature detection element mounted in the second region. The temperature detection element and the second support substrate are thermally connected to each other by a thermally conductive member.
申请公布号 US2016133815(A1) 申请公布日期 2016.05.12
申请号 US201414899080 申请日期 2014.07.25
申请人 KYOCERA Corporation 发明人 Akabane Kenichi
分类号 H01L35/32;H01L35/02 主分类号 H01L35/32
代理机构 代理人
主权项 1. A thermoelectric module comprising: a first support substrate including a first region and a second region that is adjacent to the first region; a second support substrate facing the first region; a plurality of thermoelectric elements arranged between the first region and the second support substrate; a temperature detection element mounted in the second region; and a thermally conductive member, wherein the temperature detection element is thermally connected to the second support by the thermally conductive member.
地址 Kyoto-shi, Kyoto JP