METHOD FOR INDIRECT PLASMA TREATMENT OF RELEASE LAYERS

摘要

The invention relates to a method for the indirect plasma treatment of a release layer, comprising the following steps: introducing a plasma gas into a discharge area; exciting the plasma in a plasma state by discharging; blowing the plasma gas in a plasma state out from the discharge area; and exposing the release layer to the plasma gas in a plasma state after the blowing out of the plasma gas from the discharge area. The invention also relates to release layers which can be obtained according to said method; to release liners comprising a support and said type of release layer; and to adhesive strips comprising the claimed release liner and at least one adhesive mass.