发明名称 |
RESIN MOLDING FOR SURFACE MOUNTING LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin package for surface mounting light-emitting device composed of a white thermosetting composition which does not induce deterioration of mold surface even after long period continuous molding, and to provide a surface mounting light-emitting device.SOLUTION: A resin molding 4 for surface mounting light-emitting device consists of a molding of white thermosetting composition having a recess 13 for mounting an optical semiconductor element, and at least a part of the recess uses zinc oxide as a white pigment. A resin hardening body obtained by hot pressing and then hardening a white thermosetting composition has an optical reflectance of 80% or more at 460 nm.SELECTED DRAWING: Figure 4 |
申请公布号 |
JP2016076723(A) |
申请公布日期 |
2016.05.12 |
申请号 |
JP20150241389 |
申请日期 |
2015.12.10 |
申请人 |
KANEKA CORP |
发明人 |
NARITA RYOICHI;TOZAWA TOMOKAZU;IWAHARA TAKANAO |
分类号 |
H01L33/60;C08J5/00;C08K3/22;C08L83/05;C08L83/07 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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