DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION

摘要

Embodiments of methods for forming a device include performing an oxidation inhibiting treatment to exposed ends of first and second device-to-edge conductors, and forming a package surface conductor to electrically couple the exposed ends of the first and second device-to-edge conductors. Performing the oxidation inhibiting treatment may include applying an organic solderability protectant coating to the exposed ends, or plating the exposed ends with a conductive plating material. The method may further include applying a conformal protective coating over the package surface conductor. An embodiment of a device formed using such a method includes a package body, the first and second device-to-edge conductors, the package surface conductor on a surface of the package body and extending between the first and second device-to-edge conductors, and the conformal protective coating over the package surface conductor.

主权项

1. A device, comprising:
a package body having an exterior and planar package surface, a first device-to-edge conductor with a first exposed end at the package surface, and a second device-to-edge conductor with a second exposed end at the package surface; a package surface conductor deposited on the package surface, and which electrically couples the first exposed end of the first device-to-edge conductor and the second exposed end of the second device-to-edge conductor; and a conformal protective coating over a portion of the package surface conductor that extends between the first exposed end and the second exposed end.