| 发明名称 |
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME |
| 摘要 |
A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure. |
| 申请公布号 |
US2016133605(A1) |
申请公布日期 |
2016.05.12 |
| 申请号 |
US201514938788 |
申请日期 |
2015.11.11 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
BAE Jin-Kwon;KIM Jae Choon;KIM Jichul;PARK Kyol;JO Chajea |
| 分类号 |
H01L25/065;H01L23/31;H01L23/498;H01L23/367 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a substrate; a first semiconductor package disposed on the substrate; and a second semiconductor package spaced apart from the first semiconductor package on the substrate, wherein the second semiconductor package comprises: a semiconductor chip stacked on the substrate; an adhesion part covering the semiconductor chip; and a heat-blocking structure disposed between the substrate and the semiconductor chip, wherein heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure. |
| 地址 |
Suwon-si KR |
