| 发明名称 |
Meandering Interconnect on a Deformable Substrate |
| 摘要 |
An apparatus including a first plurality of first conductive lines; and a first meandering interconnect supported in a spaced relationship from a deformable substrate, wherein the first meandering interconnect includes a first multiplicity of meandering conductive lines each of which is electrically connected to one of the first plurality of first conductive lines. |
| 申请公布号 |
US2016132150(A1) |
申请公布日期 |
2016.05.12 |
| 申请号 |
US201314890175 |
申请日期 |
2013.05.10 |
| 申请人 |
Nokia Technologies Oy |
发明人 |
COTTON Darryl;ALLEN Mark;ANDREW Piers |
| 分类号 |
G06F3/044 |
主分类号 |
G06F3/044 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus comprising:
a first plurality of first conductive lines; and a first meandering interconnect supported in a spaced relationship from a deformable substrate, wherein the first meandering interconnect comprises a first multiplicity of meandering conductive lines each of which is electrically connected to one of the first plurality of first conductive lines. |
| 地址 |
Espoo FI |
