| 发明名称 |
RESIN COMPOSITION FOR SEALING FILM, SEALING FILM, SEALING FILM WITH SUPPORT, AND ELECTRONIC APPARATUS |
| 摘要 |
The resin composition for sealing films according to the present invention comprises a liquid epoxy resin, a cyanate resin, and an organometallic salt. The electronic apparatus according to the present invention comprises an electronic component or electronic device sealed with or encapsulated in the sealing film according to the present invention. |
| 申请公布号 |
WO2016072463(A1) |
申请公布日期 |
2016.05.12 |
| 申请号 |
WO2015JP81206 |
申请日期 |
2015.11.05 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
SAKAMOTO NORIHIKO;TSUCHIKAWA SHINJI;FUJIMOTO DAISUKE;NOMURA YUTAKA;OGIHARA HIROKUNI;WATASE YUSUKE |
| 分类号 |
C08L63/00;C08G59/40;C08K3/00;C08K5/098;C08K5/13;C08K5/315;C08L79/04;H01L23/29;H01L23/31 |
主分类号 |
C08L63/00 |
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