| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure capable of efficiently disposing solder particles between electrodes and improving conduction reliability between the electrodes.SOLUTION: The manufacturing method of the connection structure includes the steps of: forming a connection part connecting a first connection object member and a second connection object member from conductive paste by heating the conductive paste to a fusion point of solder particles or higher and a setting temperature of a thermosetting component or higher, and electrically connecting a first electrode and a second electrode by a solder part within the connection part. When heating the conductive paste, the conductive paste is foamed by water that is contained in at least one of the first connection object member and the second connection object member, the conductive paste is convected by foaming, and a solder derived from the solder particles is moved to between the first electrode and the second electrode.SELECTED DRAWING: Figure 1 |
