| 摘要 |
PROBLEM TO BE SOLVED: To uniformly cool a power module by running cooling water in a plurality of coolant passages uniformly.SOLUTION: A semiconductor cooling device comprises a cooling part 40 which includes a first direct advance part 12 and a second direct advance part 22 which are separated by a plurality of radiation fins 14, 24, respectively, and which are adjacent to each other, and a bent part 32a for connecting an end 14b of the first direct advance part 12 and an end 24b of the second direct advance part 22; and which has coolant passages 11, 39, 21. The coolant passage 39 at the bent part 32a is formed to make a cross sectional area S at a position facing the second direct advance part 22 smaller than a cross sectional area S at a position facing the first direct advance part 12.SELECTED DRAWING: Figure 1 |
