VIA IN A PRINTED CIRCUIT BOARD

摘要

A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.

主权项

1. A method for forming a via in a printed circuit board, comprising:
coating both faces of dielectric laminate material with a metal coating; drilling a first hole in the dielectric laminate material; filling a first hole with the catalytic adhesive; drilling a second hole through the catalytic adhesive where the catalytic adhesive fills the first hole, the second hole having a smaller diameter than the first hole so that a layer of catalytic adhesive remains on walls of the second hole; and, forming a patterned metal layer over the metal coating on both faces of the dielectric laminate material, including placing the patterned metal layer over the layer of catalytic adhesive that remains on walls of the second hole.