摘要 |
Disclosed are an apparatus for transferring a semiconductor package and a semiconductor strip capable of having a simple structure, reducing installation space, and responding to various semiconductor packages. The transfer apparatus comprises: a package picker picking up a plurality of semiconductor packages separated from a semiconductor strip by a cutting process from a chuck table; a strip picker joined to an upper part of the package picker to load the semiconductor strip on the chuck table; a reversal driving unit reversing the strip picker and the package picker; and a linear driving unit moving the package picker and the strip picker in a vertical and horizontal direction. |