| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate with resistance to cracking by depositing a film of a thin dimension.SOLUTION: There is provided a substrate 34 having a dielectric film thereon, in which: the dielectric film comprises at least four stacked layers 24, 26, 28, 30 of a dielectric material with a thickness of 10 microns in total; the stacked layers include compressive layers 26, 30 which are subject to a compressive stress, and tensile layers 24, 28 which are subject to a tensile stress; and there are at least two spaced tensile layers which are each adjacent to one or more of the compressive layers.SELECTED DRAWING: Figure 1 |
