| 摘要 |
PROBLEM TO BE SOLVED: To suppress generation of unevenness and waviness at a cut surface when slicing a crystal ingot by a wire saw device and shorten a step of manufacturing a wafer.SOLUTION: A slice method for slicing workpiece (W) includes: a groove forming step of forming a processing groove by cutting in the workpiece with a wire (11) of the wire saw device (1); and a freezing step of cooling the crystal ingot by cooling means (27), spraying water from a water injection nozzle (23) to the processing groove (28) formed in the groove forming step to cause the water to enter the processing groove, and freezing water (D) in the processing groove.SELECTED DRAWING: Figure 1 |
