| 发明名称 |
DETACHABLE CORE SUBSTRATE AND METHOD OF MANUFACTURING CIRCUIT BOARD USING THE SAME |
| 摘要 |
A detachable core substrate and corresponding method include a primer coated metal foil laminated on a core, an insulation layer laminated on the primer coated metal foil, and a first metal foil laminated on the insulation layer. The primer coated metal foil, the insulation layer, and the first metal foil are successively laminated on an upper surface and a lower surface of the core to be symmetrical about the core. |
| 申请公布号 |
US2016135292(A1) |
申请公布日期 |
2016.05.12 |
| 申请号 |
US201514935648 |
申请日期 |
2015.11.09 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
LEE Jae-Seok |
| 分类号 |
H05K1/02;H05K3/46;H05K3/00;H05K3/06;H05K1/03;H05K1/09 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate, comprising:
a primer coated metal foil laminated on a core; an insulation layer laminated on the primer coated metal foil; and a first metal foil laminated on the insulation layer, wherein the primer coated metal foil, the insulation layer, and the first metal foil are successively laminated on an upper surface and a lower surface of the core to be symmetrical about the core. |
| 地址 |
Suwon-si KR |
