CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A chip package includes a chip, a laser stopper, an isolation layer, a redistribution layer, an insulating layer, and a conductive structure. The chip has a conductive pad, a first surface, and a second surface. The conductive pad is located on the first surface. The second surface has a first though hole to expose the conductive pad. The laser stopper is located on the conductive pad in the first though hole. The isolation layer is located on the second surface and in the first though hole. The isolation layer has a third surface opposite to the second surface, and has a second though hole to expose the laser stopper. The redistribution layer is located on the third surface, a sidewall of the second though hole, and the laser stopper in the second though hole. The conductive structure is located on the redistribution.

主权项

1. A chip package, comprising:
a chip having a conductive pad, a first surface, and a second surface opposite to the first surface, wherein the conductive pad is located on the first surface, and the second surface has a first through hole to expose the conductive pad; a laser stopper located on the conductive pad that is in the first though hole; an isolation layer located on the second surface and in the first though hole, and having a third surface opposite to the second surface, and having a second though hole to expose the laser stopper; a redistribution layer located on the third surface, a sidewall of the second though hole, and the laser stopper that is in the second though hole; an insulating layer located on the third surface and the redistribution layer, and having an opening to expose the redistribution layer; and a conductive structure located on the redistribution layer that is in the opening of the insulating layer, such that the conductive structure is electrically connected to the conductive pad.