发明名称 |
HARDWARE COMPONENT IDENTIFICATION |
摘要 |
In one example in accordance with the present disclosure, a circuit assembly includes multiple circuit board contacts, each having a first portion and a second portion where the first and second portions are conductively isolated from each other. The circuit assembly includes multiple component contacts attached to a hardware component, each touching a respective one of the multiple circuit board contacts. Each component contact is either a conductive contact that conductively bridges the first portion and second portion of the respective circuit board contact, or a non-conductive contact that leaves the first portion and second portion conductively isolated. The circuit assembly includes a hardware monitor electrically or communicatively coupled to the multiple circuit board contacts to detect a configuration or number of conductive versus non-conductive contacts used for the multiple component contacts to identify the hardware component. |
申请公布号 |
WO2016072968(A1) |
申请公布日期 |
2016.05.12 |
申请号 |
WO2014US63710 |
申请日期 |
2014.11.03 |
申请人 |
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP |
发明人 |
WU, YU-CHENG;LIAO, CHIH SHENG;HUANG, SHIH-CHUAN |
分类号 |
G06F1/20;G06F11/30 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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