发明名称 HARDWARE COMPONENT IDENTIFICATION
摘要 In one example in accordance with the present disclosure, a circuit assembly includes multiple circuit board contacts, each having a first portion and a second portion where the first and second portions are conductively isolated from each other. The circuit assembly includes multiple component contacts attached to a hardware component, each touching a respective one of the multiple circuit board contacts. Each component contact is either a conductive contact that conductively bridges the first portion and second portion of the respective circuit board contact, or a non-conductive contact that leaves the first portion and second portion conductively isolated. The circuit assembly includes a hardware monitor electrically or communicatively coupled to the multiple circuit board contacts to detect a configuration or number of conductive versus non-conductive contacts used for the multiple component contacts to identify the hardware component.
申请公布号 WO2016072968(A1) 申请公布日期 2016.05.12
申请号 WO2014US63710 申请日期 2014.11.03
申请人 HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP 发明人 WU, YU-CHENG;LIAO, CHIH SHENG;HUANG, SHIH-CHUAN
分类号 G06F1/20;G06F11/30 主分类号 G06F1/20
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