WIRING FORMATION METHOD

摘要

A resin layer (78) provided with an electrode hole (86) extending to an electrode (68), and a conductor hole (82) extending to a conductor (62) is formed on a circuit board (34). Furthermore, a metal ink (72) applied between a metal column (88) provided inside the electrode hole, and a metal column (88) provided inside the conductor hole is irradiated with a laser to form wiring for electrically connecting the electrode and the conductor. As a result, the laser irradiation amount may be changed between the metal ink on the resin layer and the metal ink on the metal columns, and the laser irradiation amount can be changed relatively easily. Furthermore, the resin layer and the metal columns are rather large, and thus the laser irradiation amount can be changed relatively easily.