| 摘要 |
A multilayer wiring coupling dual interface card carrier-band module which is suitable for various chip encapsulation modes, comprising: a carrier-band base layer (1), an electrode diaphragm layer (2), a tuning capacitance layer (3), a radio-frequency identification (RFID) coil layer (4), a bonding pad (5) and a via hole (6),wherein one surface of the carrier-band base layer (1) is the front surface of the carrier-band module, the other surface of the carrier-band base layer (1) is the back surface of the carrier-band module, the electrode diaphragm layer (2) and the tuning capacitance layer (3) are located on the front surface of the carrier-band base layer (1), and the RFID coil layer (4) and the bonding pad (5) are located on the back surface of the carrier-band base layer (1); the bonding pad (5) is arranged according to a pin position of a chip; hole metallization processing is conducted on the via hole (6) for realizing an electrical connection between the electrode diaphragm layer (2) on the front surface of the carrier-band module and the bonding pad (5) on the back surface of the carrier-band module; the electrode diaphragm layer (2) is used for conducting contact type data transmission; and the RFID coil layer (4) is matched with the tuning capacitance layer (3) for adjusting the contactless data transmission frequency of the carrier-band module. The adaptability is strong, the manufacturing process is simple, the cost is low, the production efficiency is high, and the quality is stable and good, such that the market demands of a dual interface card can be satisfied. |
