| 摘要 |
PROBLEM TO BE SOLVED: To provide a coil device which effectively dissipates heat without enlarging a packaging area.SOLUTION: A core 2 is formed by disposing two core members 2u and 2d oppositely in a vertical direction while interposing a gap 20 therebetween, a coil component 10 is formed by winding a lead wire around the core, and a coil device 1a is configured by placing the coil component on a heat dissipation substrate 5 that is formed from a metal plate. At least one of two cores is an E-shaped core member. The E-shaped core member includes side surfaces at right and left sides, is formed by extending a middle leg 3 that is formed by winding a lead wire, in a vertical direction and includes first and second radiator plates 30L and 30R each formed from a bent metal plate. The first and second radiator plates are formed in contact with a top face 12 and side surfaces 13L and 13R of the core, one-side edges 31L and 31R are disposed in lateral symmetry to the core with a gap Δw interposed therebetween and other-side edges 32L and 32R are brought into contact with the heat dissipation substrate.SELECTED DRAWING: Figure 2 |
