METHOD OF MANUFACTURING SEMICONDUCTOR COOLING DEVICE AND SEMICONDUCTOR COOLING DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent a body container part from being deformed due to a pressing load generated by friction agitation bonding when the top lid part (plate-like member) is bonded to a body container part (container-shaped member) constituting a semiconductor cooler.SOLUTION: Grooves 42a, 42b formed in the top lid part 42 (plate-like member) are actuated as a damper region for absorbing a pressing load F generated when friction agitation bonding is performed, and transmission of the pressing load F to radiation fins 29 is relieved, thereby preventing a body container part 41 (container-shaped member) from being deformed when friction agitation boding is performed.SELECTED DRAWING: Figure 5