发明名称 LIGHT-EMITTING DEVICE MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a light-emitting device (LED) mounting substrate which improves versatility in forming a circuit to which an LED is connected.SOLUTION: An LED mounting substrate 10 includes: a substrate body 1 including a surface 11; a copper foil pattern 2 that is a layer formed from a conductive material; a plurality of electrode pad couples 3 each formed from first and second electrode pad parts 31 and 32; and a solder resist 4 that is a layer formed from an insulation material. As one example, the substrate body 1 has long planar view shape for arranging a plurality of LED 50 side by side in one direction. The copper foil pattern 2 is provided on the surface 11 and includes a plurality of copper foil openings 21 which reach the surface 11. The plurality of first and second electrode pad parts 31 and 32 are provided on the surface 11, electrically connected with the copper foil pattern 2 and provided so as to hold the plurality of copper foil openings 21 therebetween. The solder resist 4 is provided on the copper foil pattern 2 and includes a plurality of first and second resist openings 41 and 42 for exposing the first and second electrode pad parts 31 and 32.SELECTED DRAWING: Figure 3
申请公布号 JP2016076552(A) 申请公布日期 2016.05.12
申请号 JP20140205060 申请日期 2014.10.03
申请人 MITSUBISHI ELECTRIC CORP;MITSUBISHI ELECTRIC CORP 发明人 OKUDA NORIAKI;SHIMOJIMA MITSUHIRO
分类号 H01L33/48;F21S2/00;F21V19/00;H05K1/02 主分类号 H01L33/48
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