发明名称 PRINTED CIRCUIT BOARD STRUCTURE
摘要 A printed circuit board structure includes a main body and a connecting interface. The connecting interface connects and is located at a side of the main body. The connecting interface includes conductive layers and insulation layers. The conductive layers at least include a first, a second, a third, a fourth conductive layer. The insulation layers at least include a first, a second, a third insulation layers. The insulation layers and the conductive layers are alternately disposed. The first insulation layer is located between the first conductive layer and the second conductive layer. The first conductive layer and the second conductive layer are partially overlapped in their orthographic projections on the first insulation layer. The second insulation layer is located between the second conductive layer and the third conductive layer. The third insulation layer is located between the third conductive layer and the fourth conductive layer.
申请公布号 US2016135291(A1) 申请公布日期 2016.05.12
申请号 US201514932944 申请日期 2015.11.04
申请人 Liu Hsin-Ting;Lin Ming-Jen;Chen Chun-Hung 发明人 Liu Hsin-Ting;Lin Ming-Jen;Chen Chun-Hung
分类号 H05K1/02;H05K1/11 主分类号 H05K1/02
代理机构 代理人
主权项 1. A printed circuit board structure, comprising: a main body; and a connecting interface connected to the main body and located at a side of the main body, wherein the connecting interface includes: a plurality of conductive layers; anda plurality of insulation layers, wherein the insulation layers and the conductive layers are alternately disposed,wherein a first insulation layer of the insulation layers is located between a first conductive layer and a second conductive layer of the conductive layers, an orthographic projection of the first conductive layer on the first insulation layer is partially overlapped with an orthographic projection of the second conductive layer on the first insulation layer, a second insulation layer of the insulation layers is located between the second conductive layer and a third conductive layer of the conductive layers, a third insulation layer of the insulation layers is located between the third conductive layer and a fourth conductive layer of the conductive layers.
地址 New Taipei City TW