发明名称 WIRING BOARD AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To suppress impedance mismatch.SOLUTION: On a wiring board, a differential wiring that is one of high-speed wirings is configured on a substrate by a combination of a wirebond and a microstrip line. In the microstrip line, at the wirebond side, in concrete terms, a wiring (also referred to as a projection part) projecting under the wirebond is formed. This disclosure can be applied to a wiring board assembled to a semiconductor device, for example.SELECTED DRAWING: Figure 2
申请公布号 JP2016076615(A) 申请公布日期 2016.05.12
申请号 JP20140206465 申请日期 2014.10.07
申请人 SONY CORP 发明人 MURAOKA TOSHIJI
分类号 H05K1/02;H01L21/60;H01L23/12;H01P3/04;H01P3/08;H01P5/02 主分类号 H05K1/02
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