摘要 |
PROBLEM TO BE SOLVED: To suppress impedance mismatch.SOLUTION: On a wiring board, a differential wiring that is one of high-speed wirings is configured on a substrate by a combination of a wirebond and a microstrip line. In the microstrip line, at the wirebond side, in concrete terms, a wiring (also referred to as a projection part) projecting under the wirebond is formed. This disclosure can be applied to a wiring board assembled to a semiconductor device, for example.SELECTED DRAWING: Figure 2 |