发明名称 SEMICONDUCTOR COOLING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To fix a cooling section to a plurality of power modules, that vary in the size, reliably and tightly by a simple structure.SOLUTION: After placing extrusion tubes 21a, 21b (cooling sections) with fin, internally having a refrigerant flow path 21f partitioned by a plurality of heat dissipation fins 21c, across the upper surface of a plurality of power modules 31a-31f sealing heat generation semiconductors 30a-30f, the extrusion tubes 21a, 21b with fin are abutted against the plurality of power modules 31a-31f, respectively, and compressed. In a state where the extrusion tubes 21a, 21b are deformed plastically and adhere to the power modules 31a-31f, respectively, elastic members 14a, 14b bring the extrusion tubes 21a, 21b with fin into pressure contact with the plurality of power modules 31a-31f via load receiving plates 12a, 12b.SELECTED DRAWING: Figure 4
申请公布号 JP2016076637(A) 申请公布日期 2016.05.12
申请号 JP20140207089 申请日期 2014.10.08
申请人 CALSONIC KANSEI CORP 发明人 HAMASAKI YUICHI;KOBAYASHI HIDETAKA;SAWAGUCHI MASA;SUGAWARA HIROMASA;YOSHIHARA TOSHIKAZU
分类号 H01L23/40;H01L23/473;H01L25/07;H01L25/18;H05K7/20 主分类号 H01L23/40
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