METHOD FOR MANUFACTURING COOLER FOR SEMICONDUCTOR-MODULE, COOLER FOR SEMICONDUCTOR-MODULE, SEMICONDUCTOR-MODULE AND ELECTRICALLY-DRIVEN VEHICLE

摘要

A cooler for a semiconductor-module includes: a heat sink which has an appearance of a cuboid structure to one side of which a flow rate control plate is fixed; a thermal radiation plate on an outer surface of which semiconductor devices are bonded; and a tray-shaped cooling jacket having: a coolant introduction channel; a coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel provided between the coolant introduction and extraction channels. The heat sink is provided in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels. The thermal radiation plate is fixed so as to close an opening the cooling jacket.

主权项

1. A method for manufacturing a cooler for a semiconductor module, the cooler including: a heat sink having an appearance of a cuboid structure; a heat radiation plate to an outer surface of which a semiconductor device is bonded; and a tray-shaped cooling jacket including: a coolant introduction channel to introduce a coolant through a coolant inlet portion; a coolant extraction channel to extract the coolant to a coolant outlet portion, the coolant extraction channel extending in parallel to the coolant introduction channel; and a cooling channel between the coolant introduction and extraction channels, the method comprising:
fixing a flow rate control plate to one side of the heat sink; arranging the heat sink in the cooling channel of the cooling jacket so that the flow rate control plate extends in a boundary between the coolant extraction channel and the cooling channel, and a plurality of channels provided for the heat sink extend orthogonally to the coolant introduction and extraction channels; and bonding the heat radiation plate by brazing so as to close an opening the cooling jacket.