发明名称 AIR GAP STRUCTURE WITH BILAYER SELECTIVE CAP
摘要 A semiconductor substrate including one or more conductors is provided. A first layer and a second layer are deposited on the top surface of the conductors. A dielectric cap layer is formed over the semiconductor substrate and air gaps are etched into the dielectric layer. The result is a bilayer cap air gap structure with effective electrical performance.
申请公布号 US2016133575(A1) 申请公布日期 2016.05.12
申请号 US201514960483 申请日期 2015.12.07
申请人 International Business Machines Corporation 发明人 Gates Stephen M.;Huang Elbert E.;Kioussis Dimitri R.;Penny Christopher J.;Priyadarshini Deepika
分类号 H01L23/532 主分类号 H01L23/532
代理机构 代理人
主权项 1. A semiconductor structure comprising: a dielectric layer present on a semiconductor substrate; one or more conductors within the dielectric layer, wherein the one or more conductors have a top surface; a bilayer cap present on the one or more conductors, wherein the bilayer cap comprises a first layer and a second layer; and a plurality of air gaps, wherein the air gaps are etched into the dielectric layer.
地址 Armonk NY US