发明名称 |
AIR GAP STRUCTURE WITH BILAYER SELECTIVE CAP |
摘要 |
A semiconductor substrate including one or more conductors is provided. A first layer and a second layer are deposited on the top surface of the conductors. A dielectric cap layer is formed over the semiconductor substrate and air gaps are etched into the dielectric layer. The result is a bilayer cap air gap structure with effective electrical performance. |
申请公布号 |
US2016133575(A1) |
申请公布日期 |
2016.05.12 |
申请号 |
US201514960483 |
申请日期 |
2015.12.07 |
申请人 |
International Business Machines Corporation |
发明人 |
Gates Stephen M.;Huang Elbert E.;Kioussis Dimitri R.;Penny Christopher J.;Priyadarshini Deepika |
分类号 |
H01L23/532 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor structure comprising:
a dielectric layer present on a semiconductor substrate; one or more conductors within the dielectric layer, wherein the one or more conductors have a top surface; a bilayer cap present on the one or more conductors, wherein the bilayer cap comprises a first layer and a second layer; and a plurality of air gaps, wherein the air gaps are etched into the dielectric layer. |
地址 |
Armonk NY US |