INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN AN ENCAPSULATION LAYER

摘要

Some novel features pertain to an integrated device package that includes an encapsulation portion and a redistribution portion. The encapsulation portion includes a first die, a first set of vias coupled to the first die, a second die, a second set of vias coupled to the second die, a bridge, and an encapsulation layer. The bridge is configured to provide an electrical path between the first die and the second die. The bridge is coupled to the first die through the first set of vias. The bridge is further coupled to the second die through the second set of vias. The encapsulation layer at least partially encapsulates the first die, the second die, the bridge, the first set of vias, and the second set of vias. The redistribution portion is coupled to the encapsulation portion. The redistribution portion includes a set of redistribution interconnects, and at least one dielectric layer.

主权项

1. An integrated device package comprising:
an encapsulation portion comprising:
a first die;a first set of vias coupled to the first die;a second die;a second set of vias coupled to the second die;a bridge configured to provide an electrical path between the first die and the second die, the bridge coupled to the first die through the first set of vias, the bridge further coupled to the second die through the second set of vias;an encapsulation layer at least partially encapsulating the first die, the second die, the bridge, the first set of vias, and the second set of vias; and a redistribution portion coupled to the encapsulation portion, the redistribution portion comprising:
a set of redistribution interconnects; andat least one dielectric layer.