Power Module

摘要

A power module, having a printed circuit board core, which contains at least one electronic power component embedded in an insulating layer, the core being arranged between two heat dissipation plates wherein each heat dissipation plate has a metal outer layer and a metal inner layer electrically separated from said metal outer layer by a thermally conductive, electrically insulating intermediate layer, and electrode terminals of the at least one power component are guided out from the core via terminal lines, wherein the printed circuit board core on both sides of the insulating layer has a conductor layer, at least one conductor layer is structured at least in portions, and each conductor layer is connected at least in portions via a conductive, metal intermediate layer to a metal inner layer of the heat dissipation plate, contacts run from the structured conductor layer to the electrode terminals of the at least one power component, and at least one power terminal of the at least one power component is connected via a contact, a portion of a structured conductor layer, and the conductive, metal intermediate layer to at least one portion of the metal inner layer of the heat dissipation plate, which forms part of the terminal line to the electrode terminal.

主权项

1. A power module, comprising a printed circuit board core, that contains at least one electronic power component embedded in an insulating layer, the core being arranged between two heat dissipation plates, wherein each heat dissipation plate has a metal exterior layer and a metal interior layer that is electrically isolated from the metal exterior layer by a heat conducting, electrically insulating intermediate layer, and electrode connections of the at least one power component being guided out of the core via connecting lines
characterized in that the printed circuit board core has a conductor layer on both sides of the insulating layer, at least one conductor layer is structured at least in sections and each conductor layer is connected, at least in sections, to a metal interior layer of the heat dissipation plate via a conducting, metal intermediate coating, contacts run from the structured conductor layer to the electrode connections of the at least one power component, and at least one power connection of the at least one power component is connected to at least one section of the metal interior layer of the heat dissipation plate, which forms part of the connecting line to the electrode connection, via a contact, a section of a structured conductor layer, and the conducting, metal intermediate coating, at least the metal interior layers of the heat dissipation plates being made of copper and the insulating layer of the printed circuit board core and insulating material for filling or covering intermediate spaces of the conductor structures being made of the same insulating material.