发明名称 |
SUBSTRATE STRUCTURES AND METHODS OF MANUFACTURE |
摘要 |
A semiconductor package. Implementations may include a substrate including a metallic baseplate coupled with an electrically insulative layer and a plurality of metallic traces coupled to the electrically insulative layer on a surface of the electrically insulative layer opposing a surface of the electrically insulative layer coupled to the metallic baseplate. The plurality of metallic traces may include at least two different trace thicknesses, where the trace thicknesses are measured perpendicularly to the surface of the electrically insulative layer coupled with the metallic baseplate. The package may include at least one semiconductor device coupled to the substrate, a mold compound that encapsulates the power electronic device and at least a portion of the substrate, and at least one package electrical connector coupled with the substrate. |
申请公布号 |
US2016133533(A1) |
申请公布日期 |
2016.05.12 |
申请号 |
US201514816520 |
申请日期 |
2015.08.03 |
申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
LIN Yusheng;TAKAKUSAKI Sadamichi |
分类号 |
H01L23/14;H01L23/00;H01L21/768;H01L23/538 |
主分类号 |
H01L23/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
Phoenix AZ US |