| 摘要 |
PROBLEM TO BE SOLVED: To inhibit deterioration in reliability of a semiconductor device.SOLUTION: A semiconductor device 1 comprises: a tub (chip mounting part) 2 including a top face 2a on which a semiconductor chip 3 is mounted, an under surface exposed from an encapsulated body 6 and a plurality of lateral faces 2c located between the top face 2a and the under surface. The plurality of lateral faces 2c of the tub 2 include a portion 2c1 which continues to the under surface of the tub 2, a portion 2c2 which lies outside the portion 2c1 and continues to the top face 2a of the tub 2 and a portion 2c3 which lies outside the portion 2c2 and continues to the top face 2a of the tub 2 and faces a direction the same with the portions 2c1, 2c2. In plan view, an outer edge of the semiconductor chip 3 lies between the portion 2c3 and the portion 2c2 of the tub 2, and an outer edge of an adhesive for fixing the semiconductor chip 3 and the tub 2 by bonding lies between the semiconductor chip 3 and the portion 2c2.SELECTED DRAWING: Figure 11 |
