PROCESSING COMPONENT, PROCESSING MODULE, AND PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To improve the processing rate of a processing object to improve the in-plane uniformity of the processing object.SOLUTION: A buff processing component 350 includes: heads to which buff pads, which are placed in contact with a wafer W and moved relative to the wafer W to perform predetermined processing to the wafer W, are attached; and buff arms 600-1, 600-2 for holding the heads. The heads include: a first buff head 500-1 to which a first buff pad 502-1 having a diameter smaller than that of the wafer W is attached; and a second buff head 500-2 to which a second buff pad 502-2 having a diameter smaller than that of the first buff pad 502-1 is attached, the second buff head being different from the first buff head 500-1.SELECTED DRAWING: Figure 5