LAMINATE RF CHOKE FOR FLIP-CHIP POWER AMPLIFIER

摘要

A circuit includes a flip-chip die and a laminate substrate. The flip-chip die includes a first bump and a second bump. A first metal layer is disposed on the laminate substrate. The first metal layer includes a first transmission line having a plurality of segments forming a first spiral inductor. A first end of the first transmission line is electrically coupled to the first bump. A second end of the first transmission line is electrically coupled to a first power supply pin.