| 摘要 |
The purpose of the present invention is to provide a probe whereby increased density of electronic components, being the measurement target, is possible on a circuit board. The probe (1) is capable of simultaneously measuring a plurality of locations. The probe (1) comprises: a plurality of main body sections (30) including central conductors (20) that come in contact with a connector (300); and a first member (50) that bundles the plurality of main body sections (30). A recessed section (C1), having the tips of the plurality of central conductors (20) protruding from the bottom surface thereof, is provided in the first member (50). The recessed section (C1) has a sloping surface (S1) that spreads from said bottom surface towards an opening. |
