SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

摘要

A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet.

主权项

1. A substrate for mounting an electronic component, comprising:
a base material comprising an insulating resin material; a first conductor layer formed on a first surface of the base material; a second conductor layer formed on a second surface of the base material on an opposite side with respect to the first surface of the base material; and a metal block inserted into a hole penetrating through the first conductor layer, the base material and the second conductor layer such that the metal block is fitted in the hole, wherein the base material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor layer, the metal block has a surface on a first conductor layer side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole is formed such that the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on a second conductor layer side and that the metal block is positioned in contact with the second fitting inlet.