CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

摘要

Provided are: a circuit board which has excellent interlayer adhesion and solder heat resistance; and a method for manufacturing this circuit board. This circuit board is manufactured by a manufacturing method which comprises: a step for preparing a plurality of thermoplastic liquid crystal polymer films of at least one kind; a step for producing a unit circuit board by forming a conductive layer on one surface or on both surfaces of at least one film among the plurality of films; a step for forming a laminate by laminating the plurality of films including the unit circuit board; a thermal compression bonding step for integrating the laminate by heating the laminate under pressure to a first temperature at which interlayer bonding occurs; and a step wherein a structure control heat treatment is carried out for a predetermined period of time by heating the laminate, after the heating at the first temperature, at a second temperature that is lower than the first temperature and is also lower than the melting point of a thermoplastic liquid crystal polymer film which has the lowest melting point among the plurality of the thermoplastic liquid crystal polymer films.